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"Capacitive and Inductive TSV-to-TSV Resilient Approaches for 3D ICs."

Pooria M. Yaghini et al. (2016)

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DOI: 10.1109/TC.2015.2498550

access: closed

type: Journal Article

metadata version: 2020-06-15

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  dblp key:
  - journals/tc/YaghiniEYBG16
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  persistent URL:
  - https://dblp.org/rec/journals/tc/YaghiniEYBG16
Pooria M. Yaghini, Ashkan Eghbal, Siavash S. Yazdi, Nader Bagherzadeh, Michael M. Green:
Capacitive and Inductive TSV-to-TSV Resilient Approaches for 3D ICs. IEEE Trans. Computers 65(3): 693-705 (2016)

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