"Multicast-Based Testing and Thermal-Aware Test Scheduling for 3D ICs with ..."

Dong Xiang, Krishnendu Chakrabarty, Hideo Fujiwara (2016)

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DOI: 10.1109/TC.2015.2493548

access: closed

type: Journal Article

metadata version: 2022-01-03

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Dong Xiang, Krishnendu Chakrabarty, Hideo Fujiwara:
Multicast-Based Testing and Thermal-Aware Test Scheduling for 3D ICs with a Stacked Network-on-Chip. IEEE Trans. Computers 65(9): 2767-2779 (2016)

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