"Fault Diagnosis of Wafer Acceptance Test and Chip Probing Between ..."

Shu-Kai S. Fan, Chun-Wei Cheng, Du-Ming Tsai (2022)

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DOI: 10.1109/TASE.2021.3106011

access: closed

type: Journal Article

metadata version: 2022-11-13

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Shu-Kai S. Fan, Chun-Wei Cheng, Du-Ming Tsai:
Fault Diagnosis of Wafer Acceptance Test and Chip Probing Between Front-End-of-Line and Back-End-of-Line Processes. IEEE Trans Autom. Sci. Eng. 19(4): 3068-3082 (2022)

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