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"A framework for architecture-level power, area, and thermal simulation and ..."

Ming-yu Hsieh et al. (2011)

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DOI: 10.1145/1964218.1964229

access: closed

type: Journal Article

metadata version: 2021-10-14

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  - journals/sigmetrics/HsiehRRTS11
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  - https://dblp.org/rec/journals/sigmetrics/HsiehRRTS11
Ming-yu Hsieh, Arun Rodrigues, Rolf Riesen, Kevin Thompson, William J. Song:
A framework for architecture-level power, area, and thermal simulation and its application to network-on-chip design exploration. SIGMETRICS Perform. Evaluation Rev. 38(4): 63-68 (2011)

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