"Wafer-to-wafer bonding for microstructure formation."

Martin A. Schmidt (1998)

> Home

Details and statistics

DOI: 10.1109/5.704262

access: closed

type: Journal Article

metadata version: 2022-02-28

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/pieee/Schmidt98
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/pieee/Schmidt98
Martin A. Schmidt:
Wafer-to-wafer bonding for microstructure formation. Proc. IEEE 86(8): 1575-1585 (1998)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.