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"Large-Area Soft e-Skin: The Challenges Beyond Sensor Designs."

Ravinder Dahiya et al. (2019)

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DOI: 10.1109/JPROC.2019.2941366

access: open

type: Journal Article

metadata version: 2023-07-27

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  - journals/pieee/DahiyaYLMBHJ19
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  - https://dblp.org/rec/journals/pieee/DahiyaYLMBHJ19
Ravinder Dahiya, Nivasan Yogeswaran, Fengyuan Liu, Libu Manjakkal, Etienne Burdet, Vincent Hayward, Henrik Jörntell:
Large-Area Soft e-Skin: The Challenges Beyond Sensor Designs. Proc. IEEE 107(10): 2016-2033 (2019)

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