default search action
"A Model of BGA Thermal Vias as an Example of Lumped Parameter Analysis in ..."
Luigi Pietro Maria Colombo, Davide Paleari, Alexey Petrushin (2009)
- Luigi Pietro Maria Colombo, Davide Paleari, Alexey Petrushin:
A Model of BGA Thermal Vias as an Example of Lumped Parameter Analysis in Thermal Modeling of SiPs and Stacked Die Packages. Proc. IEEE 97(1): 70-77 (2009)
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.