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"Wafer Direct Bonding: From Advanced Substrate Engineering to Future ..."
Silke H. Christiansen, Rajendra Singh, Ulrich Gosele (2006)
- Silke H. Christiansen, Rajendra Singh, Ulrich Gosele:
Wafer Direct Bonding: From Advanced Substrate Engineering to Future Applications in Micro/Nanoelectronics. Proc. IEEE 94(12): 2060-2106 (2006)
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