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"Failure mechanisms of solder interconnects under current stressing in ..."

Ze Zhu, Yan-Cheong Chan, Fengshun Wu (2018)

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DOI: 10.1016/J.MICROREL.2018.10.002

access: closed

type: Journal Article

metadata version: 2020-02-22

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Ze Zhu, Yan-Cheong Chan, Fengshun Wu:
Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressing. Microelectron. Reliab. 91: 179-182 (2018)

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