"Effect of elevated temperature on PCB responses and solder interconnect ..."

H. W. Zhang et al. (2015)

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DOI: 10.1016/J.MICROREL.2015.07.033

access: closed

type: Journal Article

metadata version: 2020-02-22

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H. W. Zhang, Yang Liu, J. Wang, F. L. Sun:
Effect of elevated temperature on PCB responses and solder interconnect reliability under vibration loading. Microelectron. Reliab. 55(11): 2391-2395 (2015)

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