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"Adhesion improvement of Cu-based substrate and epoxy molding compound ..."
Wenjing Zhang et al. (2012)
- Wenjing Zhang, Wei Luo, Anmin Hu, Ming Li:
Adhesion improvement of Cu-based substrate and epoxy molding compound interface by hierarchical structure preparation. Microelectron. Reliab. 52(6): 1157-1164 (2012)
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