"Anand model and FEM analysis of SnAgCuZn lead-free solder joints in wafer ..."

Liang Zhang et al. (2014)

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DOI: 10.1016/J.MICROREL.2013.07.100

access: closed

type: Journal Article

metadata version: 2020-02-22

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Liang Zhang, Ji-guang Han, Yong-huan Guo, Cheng-wen He:
Anand model and FEM analysis of SnAgCuZn lead-free solder joints in wafer level chip scale packaging devices. Microelectron. Reliab. 54(1): 281-286 (2014)

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