"Thermal properties of diamond/copper composite material."

Katsuhito Yoshida, Hideaki Morigami (2004)

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DOI: 10.1016/S0026-2714(03)00215-4

access: closed

type: Journal Article

metadata version: 2020-02-22

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Katsuhito Yoshida, Hideaki Morigami:
Thermal properties of diamond/copper composite material. Microelectron. Reliab. 44(2): 303-308 (2004)

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