Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Microstructure and morphology of interfacial intermetallic compound ..."

Guoshuai Yang, Donghua Yang, Liangliang Li (2015)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2015.06.056

access: closed

type: Journal Article

metadata version: 2023-06-28

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/YangYL15
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/YangYL15
Guoshuai Yang, Donghua Yang, Liangliang Li:
Microstructure and morphology of interfacial intermetallic compound CoSn₃ in Sn-Pb/Co-P solder joints. Microelectron. Reliab. 55(11): 2403-2411 (2015)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.