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"Void formation at the interface in Sn/Cu solder joints."

Yang Yang et al. (2011)

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DOI: 10.1016/J.MICROREL.2011.06.026

access: closed

type: Journal Article

metadata version: 2020-02-22

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Yang Yang, Hao Lu, Chun Yu, Yongzhi Li:
Void formation at the interface in Sn/Cu solder joints. Microelectron. Reliab. 51(12): 2314-2318 (2011)

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