"Processing assessment and adhesion evaluation of copper through-silicon ..."

Y. Yang et al. (2010)

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DOI: 10.1016/J.MICROREL.2010.07.019

access: closed

type: Journal Article

metadata version: 2020-02-22

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Y. Yang, Riet Labie, F. Ling, C. Zhao, A. Radisic, Jan Van Olmen, Youssef Travaly, Bert Verlinden, Ingrid De Wolf:
Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures. Microelectron. Reliab. 50(9-11): 1636-1640 (2010)

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