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"Structural reliability assessment of multi-stack package (MSP) under high ..."

Se Young Yang et al. (2006)

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DOI: 10.1016/J.MICROREL.2006.07.089

access: closed

type: Journal Article

metadata version: 2024-01-19

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Se Young Yang, Wang-Joo Lee, S. H. Jeong, S. J. Lee:
Structural reliability assessment of multi-stack package (MSP) under high temperature storage (HTS) testing condition. Microelectron. Reliab. 46(9-11): 1904-1909 (2006)

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