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"A simulation-based multi-objective design optimization of electronic ..."

Leon Xu et al. (2004)

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DOI: 10.1016/J.MICROREL.2004.04.024

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/XuRRWHA04
Leon Xu, Tommi Reinikainen, Wei Ren, Bo Ping Wang, Zhenxue Han, Dereje Agonafer:
A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending. Microelectron. Reliab. 44(12): 1977-1983 (2004)

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