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"Reliability and failure analysis of SAC 105 and SAC 1205N lead-free solder ..."

Mei-Ling Wu, Jia-Shen Lan (2018)

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DOI: 10.1016/J.MICROREL.2017.12.013

access: closed

type: Journal Article

metadata version: 2020-02-22

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Mei-Ling Wu, Jia-Shen Lan:
Reliability and failure analysis of SAC 105 and SAC 1205N lead-free solder alloys during drop test events. Microelectron. Reliab. 80: 213-222 (2018)

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