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"Optimization and validation of thermal management for a RF front-end SiP ..."

Peng Wu et al. (2016)

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DOI: 10.1016/J.MICROREL.2016.08.012

access: closed

type: Journal Article

metadata version: 2022-10-13

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Peng Wu, Fengze Hou, Cheng Chen, Jun Li, Fengman Liu, Jing Zhang, Liqiang Cao, Lixi Wan:
Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate. Microelectron. Reliab. 65: 98-107 (2016)

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