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"Characterization on acceleration-factor equation for packaging-solder ..."

K.-C. Wu, Kuo-Ning Chiang (2016)

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DOI: 10.1016/J.MICROREL.2016.08.005

access: closed

type: Journal Article

metadata version: 2022-11-23

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K.-C. Wu, Kuo-Ning Chiang:
Characterization on acceleration-factor equation for packaging-solder joint reliability. Microelectron. Reliab. 65: 167-172 (2016)

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