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"Design of experiments to investigate reliability for solder joints PBGA ..."

Mei-Ling Wu (2010)

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DOI: 10.1016/J.MICROREL.2009.09.007

access: closed

type: Journal Article

metadata version: 2024-05-07

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Mei-Ling Wu:
Design of experiments to investigate reliability for solder joints PBGA package under high cycle fatigue. Microelectron. Reliab. 50(1): 127-139 (2010)

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