"Mean-time-to-failure evaluations of encapsulation materials for LED ..."

Jau-Sheng Wang et al. (2012)

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DOI: 10.1016/J.MICROREL.2011.07.057

access: closed

type: Journal Article

metadata version: 2022-10-02

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Jau-Sheng Wang, Chun-Chin Tsai, Jyun-Sian Liou, Wei-Chih Cheng, Shun-Yuan Huang, Gi-Hung Chang, Wood-Hi Cheng:
Mean-time-to-failure evaluations of encapsulation materials for LED package in accelerated thermal tests. Microelectron. Reliab. 52(5): 813-817 (2012)

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