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"Drop impact reliability of Sn-1.0Ag-0.5Cu BGA interconnects with different ..."

Bo Wang et al. (2012)

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DOI: 10.1016/J.MICROREL.2012.02.001

access: closed

type: Journal Article

metadata version: 2020-02-22

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Bo Wang, Jiajun Li, Anthony Gallagher, James Wrezel, Pongpinit Towashirporn, Naiqin Zhao:
Drop impact reliability of Sn-1.0Ag-0.5Cu BGA interconnects with different mounting methods. Microelectron. Reliab. 52(7): 1475-1482 (2012)

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