"Experiment study of dynamic looping process for thermosonic wire bonding."

Fuliang Wang, Yun Chen, Lei Han (2012)

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DOI: 10.1016/J.MICROREL.2012.01.014

access: closed

type: Journal Article

metadata version: 2025-03-04

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Fuliang Wang, Yun Chen, Lei Han:
Experiment study of dynamic looping process for thermosonic wire bonding. Microelectron. Reliab. 52(6): 1105-1111 (2012)

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