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"Mechanisms and solutions to the brittle solder joint in electroless Ni ..."

Xuan Wang, C. Key Chung (2016)

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DOI: 10.1016/J.MICROREL.2016.08.006

access: closed

type: Journal Article

metadata version: 2020-02-22

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Xuan Wang, C. Key Chung:
Mechanisms and solutions to the brittle solder joint in electroless Ni plating. Microelectron. Reliab. 65: 173-177 (2016)

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