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"Solder-joint reliability of HVQFN-packages subjected to thermal cycling."

J. de Vries, M. Jansen, Willem D. van Driel (2009)

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DOI: 10.1016/J.MICROREL.2008.12.007

access: closed

type: Journal Article

metadata version: 2020-02-22

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J. de Vries, M. Jansen, Willem D. van Driel:
Solder-joint reliability of HVQFN-packages subjected to thermal cycling. Microelectron. Reliab. 49(3): 331-339 (2009)

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