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"Four-point bending cycling: The alternative for thermal cycling solder ..."

Bart Vandevelde et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.04.008

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/VandeveldeVPDBA17
Bart Vandevelde, Filip Vanhee, Davy Pissoort, Lieven Degrendele, Johan de Baets, Bart Allaert, Ralph Lauwaert, Franco Zanon, Riet Labie, Geert Willems:
Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components. Microelectron. Reliab. 74: 131-135 (2017)

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