Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Test structure assembly for bump bond yield measurement on high density ..."

Miguel Ullán et al. (2006)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2005.10.001

access: closed

type: Journal Article

metadata version: 2020-11-05

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/UllanLCBCGMMPP06
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/UllanLCBCGMMPP06
Miguel Ullán, Manuel Lozano, Mokhtar Chmeissani, G. Blanchot, Enric Cabruja, J. García, M. Maiorino, Ricardo Martínez, Giulio Pellegrini, Carles Puigdengoles:
Test structure assembly for bump bond yield measurement on high density flip chip technologies. Microelectron. Reliab. 46(7): 1095-1100 (2006)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.