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"Study of micro-BGA solder joint reliability."

P. L. Tu et al. (2001)

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DOI: 10.1016/S0026-2714(00)00217-1

access: closed

type: Journal Article

metadata version: 2020-02-22

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P. L. Tu, Y. C. Chan, K. C. Hung, J. K. L. Lai:
Study of micro-BGA solder joint reliability. Microelectron. Reliab. 41(2): 287-293 (2001)

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