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"Reliability of microBGA assembly using no-flow underfill."

P. L. Tu, Y. C. Chan, K. C. Hung (2001)

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DOI: 10.1016/S0026-2714(01)00115-9

access: closed

type: Journal Article

metadata version: 2020-02-22

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P. L. Tu, Y. C. Chan, K. C. Hung:
Reliability of microBGA assembly using no-flow underfill. Microelectron. Reliab. 41(12): 1993-2000 (2001)

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