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"Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces."

H. W. Tseng et al. (2010)

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DOI: 10.1016/J.MICROREL.2010.05.002

access: closed

type: Journal Article

metadata version: 2023-10-20

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H. W. Tseng, C. T. Lu, Y. H. Hsiao, P. L. Liao, Y. C. Chuang, T. Y. Chung, Cheng-Yi Liu:
Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces. Microelectron. Reliab. 50(8): 1159-1162 (2010)

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