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"Failure and stress analysis of through-aluminum-nitride-via substrates ..."

Ming-Yi Tsai et al. (2016)

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DOI: 10.1016/J.MICROREL.2016.11.005

access: closed

type: Journal Article

metadata version: 2024-04-20

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Ming-Yi Tsai, C. H. Lin, K. F. Chuang, Y. H. Chang, C. T. Wu, S. C. Hu:
Failure and stress analysis of through-aluminum-nitride-via substrates during thermal reliability tests for high power LED applications. Microelectron. Reliab. 67: 120-128 (2016)

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