"Experimental evaluation of SnAgCu solder joint reliability in 100-μm ..."

Ye Tian et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.01.011

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type: Journal Article

metadata version: 2020-10-26

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Ye Tian, Xi Liu, Justin Chow, Yi-Ping Wu, Suresh K. Sitaraman:
Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies. Microelectron. Reliab. 54(5): 939-944 (2014)

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