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"Reliability and failure analysis of fine copper wire bonds encapsulated ..."

Yanhong Tian et al. (2011)

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DOI: 10.1016/J.MICROREL.2010.06.004

access: closed

type: Journal Article

metadata version: 2023-05-01

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Yanhong Tian, Chunjin Hang, Chunqing Wang, G. Q. Ouyang, D. S. Yang, J. P. Zhao:
Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound. Microelectron. Reliab. 51(1): 157-165 (2011)

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