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"The dominant effect of c-axis orientation in tin on the electromigration ..."

Yu Tian et al. (2018)

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DOI: 10.1016/J.MICROREL.2017.11.005

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/TianHMG18
Yu Tian, Jing Han, Limin Ma, Fu Guo:
The dominant effect of c-axis orientation in tin on the electromigration behaviors in tricrystal Sn-3.0Ag-0.5Cu solder joints. Microelectron. Reliab. 80: 7-13 (2018)

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