"Moisture diffusion in BCB resins used for MEMS packaging."

Angie Tetelin et al. (2003)

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DOI: 10.1016/S0026-2714(03)00329-9

access: closed

type: Journal Article

metadata version: 2020-02-22

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Angie Tetelin, Claude Pellet, Jean-Yves Delétage, B. Carbonne, Yves Danto:
Moisture diffusion in BCB resins used for MEMS packaging. Microelectron. Reliab. 43(9-11): 1939-1944 (2003)

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