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"Board level solder joint reliability analysis and optimization of ..."
Tong Yan Tee, Zhaowei Zhong (2004)
- Tong Yan Tee, Zhaowei Zhong:
Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages. Microelectron. Reliab. 44(12): 1957-1965 (2004)
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