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"Advances in Wafer Level Packaging (WLP)."

Tong Yan Tee, Xuejun Fan, Yi-Shao Lai (2010)

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DOI: 10.1016/J.MICROREL.2010.02.012

access: closed

type: Journal Article

metadata version: 2020-02-22

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Tong Yan Tee, Xuejun Fan, Yi-Shao Lai:
Advances in Wafer Level Packaging (WLP). Microelectron. Reliab. 50(4): 479-480 (2010)

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