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"A quantitative method of reliability estimation for surface mount solder ..."
Bo Tao et al. (2006)
- Bo Tao, Yiping Wu, Han Ding, You-Lun Xiong:
A quantitative method of reliability estimation for surface mount solder joints based on heating factor Qeta. Microelectron. Reliab. 46(5-6): 864-872 (2006)
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