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"Addressing the challenges in solder resistance measurement for ..."

Yung Chuen Tan, Cher Ming Tan, T. C. Ng (2010)

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DOI: 10.1016/J.MICROREL.2010.07.051

access: closed

type: Journal Article

metadata version: 2022-10-04

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Yung Chuen Tan, Cher Ming Tan, T. C. Ng:
Addressing the challenges in solder resistance measurement for electromigration test. Microelectron. Reliab. 50(9-11): 1352-1354 (2010)

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