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"Low temperature Cu-Cu thermo-compression bonding with temporary ..."

Chuan Seng Tan et al. (2012)

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DOI: 10.1016/J.MICROREL.2011.04.003

access: closed

type: Journal Article

metadata version: 2021-10-31

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Chuan Seng Tan, Dau Fatt Lim, Xiao Fang Ang, J. Wei, K. C. Leong:
Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement. Microelectron. Reliab. 52(2): 321-324 (2012)

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