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"Digital image correlation for solder joint fatigue reliability in ..."

Yaofeng Sun, John H. L. Pang (2008)

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DOI: 10.1016/J.MICROREL.2007.03.007

access: closed

type: Journal Article

metadata version: 2023-09-30

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Yaofeng Sun, John H. L. Pang:
Digital image correlation for solder joint fatigue reliability in microelectronics packages. Microelectron. Reliab. 48(2): 310-318 (2008)

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