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"Plastic analysis for through silicon via with actual etching defect of ..."

Yun-Na Sun et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.06.013

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/SunKZLLWD17
Yun-Na Sun, Dongwoo Kang, Yazhou Zhang, Jiangbo Luo, Yanmei Liu, Yan Wang, Guifu Ding:
Plastic analysis for through silicon via with actual etching defect of triangular-teeth and scallops. Microelectron. Reliab. 75: 43-52 (2017)

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