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"Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM ..."

Fenglian Sun et al. (2008)

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DOI: 10.1016/J.MICROREL.2008.06.011

access: closed

type: Journal Article

metadata version: 2020-03-09

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Fenglian Sun, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. (Kouchi) Zhang:
Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP. Microelectron. Reliab. 48(8-9): 1167-1170 (2008)

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