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"Studies on various chip-on-film (COF) packages using ultra fine pitch ..."
Kyoung-Lim Suk et al. (2012)
- Kyoung-Lim Suk, Kyosung Choo, Sung Jin Kim, Jong-Soo Kim, Kyung-Wook Paik:
Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs). Microelectron. Reliab. 52(6): 1182-1188 (2012)
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