"Influence of trace alloying elements on the ball impact test reliability ..."

Jenn-Ming Song et al. (2012)

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DOI: 10.1016/J.MICROREL.2011.09.003

access: closed

type: Journal Article

metadata version: 2020-02-22

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Jenn-Ming Song, Yao-Ren Liu, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee:
Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints. Microelectron. Reliab. 52(1): 180-189 (2012)

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