"A review on thermal cycling and drop impact reliability of SAC solder ..."

Dhafer Abdulameer Shnawah, Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin (2012)

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DOI: 10.1016/J.MICROREL.2011.07.093

access: closed

type: Journal Article

metadata version: 2020-02-22

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Dhafer Abdulameer Shnawah, Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin:
A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products. Microelectron. Reliab. 52(1): 90-99 (2012)

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