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"Constitutive modeling on creep deformation for a SnPb-based composite ..."

Yaowu Shi et al. (2010)

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DOI: 10.1016/J.MICROREL.2010.07.008

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/ShiYLXLGL10
Yaowu Shi, Yanfu Yan, Jianping Liu, Zhidong Xia, Yongping Lei, Fu Guo, Xiaoyan Li:
Constitutive modeling on creep deformation for a SnPb-based composite solder reinforced with microsized Cu particles. Microelectron. Reliab. 50(12): 2020-2025 (2010)

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