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"Experiment and numerical analysis for edge and corner bonded PoP bottom ..."

Hongbin Shi, Fa Xing Che, Toshitsugu Ueda (2011)

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DOI: 10.1016/J.MICROREL.2011.07.087

access: closed

type: Journal Article

metadata version: 2023-12-22

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Hongbin Shi, Fa Xing Che, Toshitsugu Ueda:
Experiment and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending. Microelectron. Reliab. 51(9-11): 1850-1855 (2011)

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